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Process Engineer (Electfunctionss and Electro-Plating):

Job description:

JOB DESCRIPTION

Job responsibilities:
    Responsible for the development, qualification and production of wafer bumping devices.
    To characterize and qualify new equipment,processes and materials for production use.
    Responsible for quality, yield, process, productivity and cost improvement
    Able to identify process issues & define solutions for process stabilization.
    Process data analysis & yield improvements.
    Define and generate significant design rules, defect catalogs and process documentation. 
    Provide training and leadership abilities for a team of technicians and operators  
Requirements:
    Candidate must possess at least Bachelor's Degree/Post Graduate Diploma/Professional Degree in Engineering (Chemical), Engineering (Electrical/Electronic), Engineering (Material Science), Engineering (Mechanical), Physics, Chemistry or equivalent.
    At least 1-2 Year(s) of working practice in  Plating (electro/electro-less), Sputtering/Evaporation, Plasma (Etch/Clean).
    Working expertise of commercial Plating/Sputtering/Plasma systems will be advantageous.
    expertiseable in DOE, SPC, GR&R, FMEA and 8D methodologies.
    Good interpersonal and analytical expertise with the capability to work independently.
    Good communication expertise in English (both verbal and written).
    candidates should be Malaysian citizens or hold significant residence status.

WORK LOCATION View larger map / directions View larger map

Address

14 Medan Bayan Lepas Technoplex Phase 4 Bayan Lepas Industrial Zone 11900 Penang, Malaysia

COMPANY SNAPSHOT

Average Processing Time

3 Days Fast

Registration No.

755101-P  

Industry

Electrical & Electronics

Website

http://www.pactech.com/

Telephone No.

04-6440986

Company Size

51 - 200 Employees

Working Hours

Normal & Shift

Dress Code

Smart Casual

Benefits

Free Meal Daily, Medical, Miscellaneous allowance, Dental, Parking

Spoken Language

English

COMPANY PHOTOS

   
   
   
   
   
   
   

COMPANY OVERVIEW

PacTech is a worldwide leader in wafer level packaging technologies and advanced packaging equipment manufacturing with volume production facilities across 3 continents at Germany, USA, and Malaysia. With over 20 years of practice in the industry, we have received over 100 patents and built over 1000 production machines. In line with our further expansion plan in Malaysia for high volume manufacturing in wafer level packaging services, We are pursuing individuals with strong background in chemical engineering, material science, backend processing and wafer level packaging for our PacTech Asia operations. 

WHY JOIN US?

    Foreign owned company
    Growth prospects
    Great learning practice
    Attractive remuneration & benefits
    Dynamic & challenging work environment
    Good teamwork  

Skills:

Job Category: Creative Arts/Media [ View All Creative Arts/Media Jobs ]
Language requirements:
Employment type:
Salary: Unspecified
Degree: Unspecified
Experience (year): Unspecified
Job Location: Bayan Lepas (Penang) - Plot 14, Medan Bayan Lepas, Technoplex, Phase 4 Other
Address: Bayan Lepas (Penang) - Plot 14, Medan Bayan Lepas, Technoplex, Phase 4
Company Type Employer
Post Date: 10/12/2018 / Viewed 23 times
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